PCB又稱印刷電路板、印刷線路板,是重要的電子部件,是電子元器件的支撐體,是電子元器件電氣連接的提供者。作為一名剛剛?cè)腴T的電子技術行業(yè)的硬件設計人員,在具體設計一款電子產(chǎn)品時,當你設計完這款產(chǎn)品的電原理路圖和PCB版后,接下來往往需要和PCB工廠打交道了。如果你對PCB打樣和制造行業(yè)的專業(yè)工程英文一竅不通,很多事情,往往難以和對方溝通,甚至會鬧出笑話,影響產(chǎn)品設計進度。捷多邦工程師根據(jù)長期在PCB打樣行業(yè)工作積累的經(jīng)驗,整理出以下一些常用的PCB工程方面的行業(yè)術語英文單詞,供廣大電子行業(yè)從業(yè)人員、電子愛好者學習和參考。
單面板:single sided board
雙面板:double sided board
多層板:multilayer board
剛性板:rigid board
撓性板:flexible board
剛撓板:flex-rigid board
PCB打樣:PrintedCircuitBoard proofing
附件:attached
樣品:sample
承認:approval
答復:answer;reply
規(guī)格:spec
與…同樣的:the same as
前版本:previous version(old version)
生產(chǎn):production
確認:confirm
再次確認:double confirm
工程問題:engineering query(EQ)
盡快:ASAP(as soon as possible)
生產(chǎn)文件:production gerber
聯(lián)系某人:contact somebody
提交樣板:submit sample
交貨期:delivery date
電測成本:ET(electrical test) cost
通斷測試:Open and short testing
參考:refer to
IPC標準:IPC standard
IPC二級:IPC class 2
可接受的:acceptable
允許:permit
制造:manufacture
修改:revision
公差:tolerance
忽略:ignore(omit)
工具孔:tooling hole
安裝孔:mounting hole
元件孔:component hole
槽孔:slot
郵票孔:snap off hole
導通孔:via
盲孔: blind via
埋孔:buried via
金屬化孔:PTH(plating through hole)
非金屬化孔:NPTH( no plating through hole)
孔位:hole location
避免:avoid
原設計:original design
修改:modify
按原設計:leave it as it is
附邊:waste tab
銅條:copper strip
拼板強度:panel strong
板厚:board thickness
刪除:remove(delete)
削銅:shave the copper
露銅:copper exposure
光標點:fiducial mark
不同:be different from(differ from)
內(nèi)?。篿nside radius
焊環(huán):annular ring
單板尺寸:single size
拼板尺寸:panel size
銑:routing
銑刀:router
V-cut:scoring
啞光:matt
光亮的:glossy
錫珠:solder ball(solder plugs)
阻焊:solder mask(solder resist)
阻焊開窗:solder mask opening
單面開窗:single side mask opening
補油:touch up solder mask
補線:track welds
毛刺:burrs
去毛刺:deburr
鍍層厚度:plating thickness
清潔度:cleanliness
離子污染:ionic contamination
阻燃性:flammability retardant
黑化:black oxidation
棕化:brown oxidation
紅化:red oxidation
可焊性:solderability
焊料:solder
包裝:packaging
角標:corner mark
特性阻抗:characteristic impedance
正像:positive
負片:negative
鏡像:mirror
線寬:conductor width
線距:conductor spacing
做樣:build sample
按照:as per
成品:finished
做變更:make the change
相類似:similar to
規(guī)格:specification
下移:shift down
垂直地:vertically
水平的:horizontally
增大:increase
縮小:decrease
表面處理:Surface Finishing
波峰焊:wave solder
鉆孔數(shù)據(jù):drilling date
標記:Logo
Ul 標記:Ul Marking
蝕刻標記:etched marking
周期:date code
翹曲:bow and twist
外層:outer layer
內(nèi)層:internal layer
頂層:top layer
底層:bottom layer
元件面:component side
焊接面:solder side
阻焊層:solder mask layer
絲印層:legend layer (silkscreen layer or over layer)
蘭膠層:peelable SM layer
貼片層:paste mask layer
碳油層:carbon layer
外形層:outline layer(profile layer)
白油:white ink
綠油:green ink
噴錫:hot air leveling (HAL)
水金:flash gold
插頭鍍金:plated gold edge-board contacts
金手指:Gold-finger
防氧化:Entek(OSP)
沉金:Immersion gold (chem. Gold)
沉錫:Immersion Tin(chem.Tin)
沉銀:Immersion Silver (chem. silver)
銑:CNC (mill , routing)
沖:punching
倒角:beveling
倒斜角:chamfer
倒圓角:fillet
尺寸:dimension
材料:material
介電常數(shù):Dielectric constant
菲林:film
成像:Imaging
板鍍:Panel Plating
圖鍍:Pattern Plating
后清洗:Final Cleaning
疊層:layup (stack-up)
污染焊盤:contaminate pad
分孔圖:drill chart
度數(shù):degree
被…覆蓋:be covered with
負公差:minus tolerance
標靶盤: target pad
外形公差:routing tolerance
芯板:core
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