恩智浦半導(dǎo)體推業(yè)界最小雙晶體管DFN1010

恩智浦半導(dǎo)體推業(yè)界最小雙晶體管DFN10100' title='恩智浦半導(dǎo)體推業(yè)界最小雙晶體管DFN10100' style="display: block; margin-left: auto; margin-right: auto;" />

元器件交易網(wǎng)訊 10月30日消息，據(jù)外媒Electronicsweekly報道，恩智浦半導(dǎo)體(NXP Semiconductors N.V.)今日宣布推出最小尺寸單、雙芯片封裝雙晶體管DFN1010，采用可用的1.1mm x 1mm x 0.37mm DFN塑料SMD最小封裝；擴大了其超小型分立式薄型無引腳封裝DFN1006B-3 (SOT883B)的晶體管產(chǎn)品陣容。

DFN1010的低飽和電壓范圍為12V至80V，可處理高達3.2A的峰值電流，并具有高至1kV的超安全 ESD 保護。MOSFET具有低至34mohm的極低RDS(on)值。

在智能手機、MP3播放器、平板計算機和電子閱讀器等由電池驅(qū)動的小型超薄電子設(shè)備上，該系列產(chǎn)品是各種功率轉(zhuǎn)換和開關(guān)功能的理想之選。它們同樣適合類似于空間受限的非行動通訊型應(yīng)用，如LED電視機和汽車儀表盤。

恩智浦半導(dǎo)體的雙極性小信號晶體管產(chǎn)品營銷經(jīng)理Joachim Stange表示：“在這樣一個小塑料包內(nèi)實現(xiàn)如此高峰值電流和極低RDS(on)值是前所未有的，這就節(jié)省了寶貴的PCB空間，取代SOT23成為新標(biāo)準(zhǔn)。”

DFN1010比SOT23小8倍且高度還小于其2倍；可以取代許多WL-CSP封裝設(shè)備以及更大的DFN、標(biāo)準(zhǔn)含鉛SMD封裝。

DFN1010有兩種封裝版本：單芯片 DFN1010D的3（SOT1215）封裝、雙芯片 DFN1010B-6（SOT1216）封裝。(元器件交易網(wǎng)龍燕 編譯)

外媒原文：

NXP Semiconductors has introduced its smallest transistors in a 1.1mm x 1mm x 0.37mm low-profile DFN (discrete flat no-leads) package.

The range includes mosfets with RDS(on) values down to 34mohm, as well as low saturation and general purpose transistors that boost current capabilities up to 3.2A.

Voltage range is 12V to 80V and ESD protection of 1kV.

“Achieving this high value for drain and collector current in such a small plastic package is unprecedented,” claimed Joachim Stange, product manager, transistors, NXP Semiconductors.

There are two package versions: the single-die DFN1010D-3 (SOT1215) package with a power dissipation capability of 1W comes with the special feature of tin-plated, solderable side pads. These side pads meet strict automotive requirements by offering the advantage of optical soldering inspection, as well as a better quality of solder connection compared to conventional leadless packages.

The dual-die package DFN1010B-6 (SOT1216) with the 1.1-mm² footprint is the smallest package available for dual transistors.

The products in DFN1010 can replace many WL-CSP devices, as well as larger DFN and standard leaded SMD packages such as SOT23 which is eight times the size.