當(dāng)前位置:首頁 > 嵌入式 > 嵌入式教程
[導(dǎo)讀]Virtex-6 FPGA ML605開發(fā)評(píng)估技術(shù)方案

Virtex-6 FPGA適合用有線通信,無線基礎(chǔ)設(shè)備和廣播設(shè)備等領(lǐng)域.本文介紹了Virtex-6 FPGA主要特性,以及骨干網(wǎng)OTU-4成幀與EFEC框圖, LTE 2x2無線電設(shè)計(jì)框圖和支持SD/HD/3G-SDI接口的新一代交換框圖, Virtex®-6 FPGA ML605評(píng)估套件主要特性和詳細(xì)電路圖.

The Virtex®-6 family provides the newest, most advanced features in the FPGA market. Virtex-6 FPGAs are the programmable silicon foundation for Targeted Design Platforms that deliver integrated software and hardware components to enable designers to focus on innovation as soon as their development cycle begins. Using the third-generation ASMBL™ (Advanced Silicon Modular Block) columnbased architecture, the Virtex-6 family contains multiple distinct sub-families. This overview covers the devices in the LXT, SXT, and HXT sub-families. Each sub-family contains a different ratio of features to most efficiently address the needs of a wide variety of advanced logic designs. In addition to the high-performance logic fabric, Virtex-6 FPGAs contain many built-in system-level blocks. These features allow logic designers to build the highest levels of performance and functionality into their FPGA-based systems. Built on a 40 nm state-of-theart copper process technology, Virtex-6 FPGAs are a programmable alternative to custom ASIC technology. Virtex-6 FPGAs offer the best solution for addressing the needs of high-performance logic designers, high-performance DSP designers, and high performance embedded systems designers with unprecedented logic, DSP, connectivity, and soft microprocessor capabilities.

Virtex-6 FPGA 主要特性:

• Three sub-families:

• Virtex-6 LXT FPGAs: High-performance logic with advanced serial connectivity

• Virtex-6 SXT FPGAs: Highest signal processing capability with advanced serial connectivity

• Virtex-6 HXT FPGAs: Highest bandwidth serial connectivity

• Compatibility across sub-families

• LXT and SXT devices are footprint compatible in the same package

• Advanced, high-performance FPGA Logic

• Real 6-input look-up table (LUT) technology

• Dual LUT5 (5-input LUT) option

• LUT/dual flip-flop pair for applications requiring rich register mix

• Improved routing efficiency

• 64-bit (or two 32-bit) distributed LUT RAM option per 6-input LUT

• SRL32/dual SRL16 with registered outputs option

• Powerful mixed-mode clock managers (MMCM)

• MMCM blocks provide zero-delay buffering, frequency synthesis, clock-phase shifting, inputjitter filtering, and phase-matched clock division

• 36-Kb block RAM/FIFOs

• Dual-port RAM blocks

• Programmable

- Dual-port widths up to 36 bits

- Simple dual-port widths up to 72 bits

• Enhanced programmable FIFO logic

• Built-in optional error-correction circuitry

• Optionally use each block as two independent 18 Kb blocks

• High-performance parallel SelectIO™ technology

• 1.2 to 2.5V I/O operation

• Source-synchronous interfacing using ChipSync™ technology

• Digitally controlled impedance (DCI) active termination

• Flexible fine-grained I/O banking

• High-speed memory interface support with integrated write-leveling capability

• Advanced DSP48E1 slices

• 25 x 18, two’s complement multiplier/accumulator

• Optional pipelining

• New optional pre-adder to assist filtering applications

• Optional bitwise logic functionality

• Dedicated cascade connections

• Flexible configuration options

• SPI and Parallel Flash interface

• Multi-bitstream support with dedicated fallback reconfiguration logic

• Automatic bus width detection

• System Monitor capability on all devices

• On-chip/off-chip thermal and supply voltage monitoring

• JTAG access to all monitored quantities

• Integrated interface blocks for PCI Express® designs

• Compliant to the PCI Express Base Specification 2.0

• Gen1 (2.5 Gb/s) and Gen2 (5 Gb/s) support with GTX transceivers

• Endpoint and Root Port capable

• x1, x2, x4, or x8 lane support per block

• GTX transceivers: up to 6.6 Gb/s

• Data rates below 480 Mb/s supported by oversampling in FPGA logic.

• GTH transceivers: 2.488 Gb/s to beyond 11 Gb/s

• Integrated 10/100/1000 Mb/s Ethernet MAC block

• Supports 1000BASE-X PCS/PMA and SGMII using GTX transceivers

• Supports MII, GMII, and RGMII using SelectIO technology resources

• 2500Mb/s support available

• 40 nm copper CMOS process technology

• 1.0V core voltage (-1, -2, -3 speed grades only)

• Lower-power 0.9V core voltage option (-1L speed grade only)

• High signal-integrity flip-chip packaging available in standard or Pb-free package options

Virtex®-6 FPGA典型應(yīng)用:


圖1.骨干網(wǎng)OTU-4成幀和EFEC框圖(有線通信)

圖2. LTE 2x2無線電設(shè)計(jì)框圖(無線基礎(chǔ)設(shè)備)

圖3.支持SD/HD/3G-SDI接口的新一代交換框圖(廣播通信)
[!--empirenews.page--]
Virtex®-6 FPGA ML605評(píng)估套件

The Virtex®-6 FPGA ML605 Evaluation Kit provides a development environment for system designs that demand high-performance, serial connectivity and advanced memory interfacing. The ML605 is supported by pre-verified reference designs and industry-standard FPGA Mezzanine Connectors (FMC) which allow scaling and customization with daughter cards. Integrated tools help streamline the creation of elegant solutions to complex design requirements.

The ML605 board enables hardware and software developers to create or evaluate designs targeting the Virtex®-6 XC6VLX240T-1FFG1156 FPGA.

The ML605 provides board features common to many embedded processing systems. Some commonly used features include: a DDR3 SODIMM memory, an 8-lane PCI Express® interface, a tri-mode Ethernet PHY, general purpose I/O, and a UART.  Additional user desired features can be added through mezzanine cards attached to the onboard high-speed VITA-57 FPGA Mezzanine Connector (FMC) high pin count (HPC) expansion connector, or the onboard VITA-57 FMC low pin count (LPC) connector.

This information includes:

• Current version of this user guide in PDF format

• Example design files for demonstration of Virtex-6 FPGA features and technology

• Demonstration hardware and software configuration files for the System ACE™ CF controller, Platform Flash configuration storage device, and linear flash chip

• Reference design files

• Schematics in PDF and DxDesigner formats

• Bill of materials (BOM)

• Printed-circuit board (PCB) layout in Allegro PCB format

• Gerber files for the PCB (Many free or shareware Gerber file viewers are available on the internet for viewing and printing these files.)

• Additional documentation, errata, frequently asked questions, and the latest news

Virtex®-6 FPGA ML605評(píng)估套件主要特性:

The ML605 provides the following features:

• 1. Virtex-6 XC6VLX240T-1FFG1156 FPGA

• 2. 512 MB DDR3 Memory SODIMM

• 3. 128 Mb Platform Flash XL

• 4. 32 MB Linear BPI Flash

• 5. System ACE CF and CompactFlash Connector

• 6. USB JTAG

• 7. Clock Generation

♦ Fixed 200 MHz oscillator (differential)

♦ Socketed 2.5V oscillator (single-ended)

♦ SMA connectors (differential)

♦ SMA connectors for MGT clocking

• 8. Multi-Gigabit Transceivers (GTX MGTs)

♦ FMC - HPC connector

♦ FMC - LPC connector

♦ SMA

♦ PCIe

♦ SFP Module connector

♦ Ethernet PHY SGMII interface

• 9. PCI Express Endpoint Connectivity

♦ Gen1 8-lane (x8)

♦ Gen2 4-lane (x4)

• 10. SFP Module Connector

• 11. 10/100/1000 Tri-Speed Ethernet PHY

• 12. USB-to-UART Bridge

• 13. USB Controller

• 14. DVI Codec

• 15. IIC Bus

♦ IIC EEPROM - 1 KB

♦ DDR3 SODIMM socket

♦ DVI CODEC

♦ DVI connector

♦ FMC HPC connector

♦ FMC LPC connector

♦ SFP module connector


圖4.ML605和外設(shè)框圖

圖5.ML605板外形圖[!--empirenews.page--]

圖6.ML605電路圖(1)

圖7.ML605電路圖(2)

圖8.ML605電路圖(3)

圖9.ML605電路圖(4)

圖10.ML605電路圖(5)

圖11.ML605電路圖(6)

圖12.ML605電路圖(7)

圖13.ML605電路圖(8)

圖14.ML605電路圖(9)

圖15.ML605電路圖(10)

本站聲明: 本文章由作者或相關(guān)機(jī)構(gòu)授權(quán)發(fā)布,目的在于傳遞更多信息,并不代表本站贊同其觀點(diǎn),本站亦不保證或承諾內(nèi)容真實(shí)性等。需要轉(zhuǎn)載請(qǐng)聯(lián)系該專欄作者,如若文章內(nèi)容侵犯您的權(quán)益,請(qǐng)及時(shí)聯(lián)系本站刪除。
換一批
延伸閱讀

9月2日消息,不造車的華為或?qū)⒋呱龈蟮莫?dú)角獸公司,隨著阿維塔和賽力斯的入局,華為引望愈發(fā)顯得引人矚目。

關(guān)鍵字: 阿維塔 塞力斯 華為

倫敦2024年8月29日 /美通社/ -- 英國(guó)汽車技術(shù)公司SODA.Auto推出其旗艦產(chǎn)品SODA V,這是全球首款涵蓋汽車工程師從創(chuàng)意到認(rèn)證的所有需求的工具,可用于創(chuàng)建軟件定義汽車。 SODA V工具的開發(fā)耗時(shí)1.5...

關(guān)鍵字: 汽車 人工智能 智能驅(qū)動(dòng) BSP

北京2024年8月28日 /美通社/ -- 越來越多用戶希望企業(yè)業(yè)務(wù)能7×24不間斷運(yùn)行,同時(shí)企業(yè)卻面臨越來越多業(yè)務(wù)中斷的風(fēng)險(xiǎn),如企業(yè)系統(tǒng)復(fù)雜性的增加,頻繁的功能更新和發(fā)布等。如何確保業(yè)務(wù)連續(xù)性,提升韌性,成...

關(guān)鍵字: 亞馬遜 解密 控制平面 BSP

8月30日消息,據(jù)媒體報(bào)道,騰訊和網(wǎng)易近期正在縮減他們對(duì)日本游戲市場(chǎng)的投資。

關(guān)鍵字: 騰訊 編碼器 CPU

8月28日消息,今天上午,2024中國(guó)國(guó)際大數(shù)據(jù)產(chǎn)業(yè)博覽會(huì)開幕式在貴陽舉行,華為董事、質(zhì)量流程IT總裁陶景文發(fā)表了演講。

關(guān)鍵字: 華為 12nm EDA 半導(dǎo)體

8月28日消息,在2024中國(guó)國(guó)際大數(shù)據(jù)產(chǎn)業(yè)博覽會(huì)上,華為常務(wù)董事、華為云CEO張平安發(fā)表演講稱,數(shù)字世界的話語權(quán)最終是由生態(tài)的繁榮決定的。

關(guān)鍵字: 華為 12nm 手機(jī) 衛(wèi)星通信

要點(diǎn): 有效應(yīng)對(duì)環(huán)境變化,經(jīng)營(yíng)業(yè)績(jī)穩(wěn)中有升 落實(shí)提質(zhì)增效舉措,毛利潤(rùn)率延續(xù)升勢(shì) 戰(zhàn)略布局成效顯著,戰(zhàn)新業(yè)務(wù)引領(lǐng)增長(zhǎng) 以科技創(chuàng)新為引領(lǐng),提升企業(yè)核心競(jìng)爭(zhēng)力 堅(jiān)持高質(zhì)量發(fā)展策略,塑強(qiáng)核心競(jìng)爭(zhēng)優(yōu)勢(shì)...

關(guān)鍵字: 通信 BSP 電信運(yùn)營(yíng)商 數(shù)字經(jīng)濟(jì)

北京2024年8月27日 /美通社/ -- 8月21日,由中央廣播電視總臺(tái)與中國(guó)電影電視技術(shù)學(xué)會(huì)聯(lián)合牽頭組建的NVI技術(shù)創(chuàng)新聯(lián)盟在BIRTV2024超高清全產(chǎn)業(yè)鏈發(fā)展研討會(huì)上宣布正式成立。 活動(dòng)現(xiàn)場(chǎng) NVI技術(shù)創(chuàng)新聯(lián)...

關(guān)鍵字: VI 傳輸協(xié)議 音頻 BSP

北京2024年8月27日 /美通社/ -- 在8月23日舉辦的2024年長(zhǎng)三角生態(tài)綠色一體化發(fā)展示范區(qū)聯(lián)合招商會(huì)上,軟通動(dòng)力信息技術(shù)(集團(tuán))股份有限公司(以下簡(jiǎn)稱"軟通動(dòng)力")與長(zhǎng)三角投資(上海)有限...

關(guān)鍵字: BSP 信息技術(shù)
關(guān)閉
關(guān)閉