全球晶圓10月15日上海全球論壇日程

時(shí)間：2010-10-09 08:45:00

關(guān)鍵字：晶圓 GLOBALFOUNDRIES RS QUESTION

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[導(dǎo)讀]GLOBAL Technology Conference Asia - Shanghai Agenda Start Time Activity & Presentation Title Presenter 8:00 Registration & Breakfast 9:00 "Welcome and Introd

GLOBAL Technology Conference Asia - Shanghai Agenda

Start Time	Activity & Presentation Title	Presenter
8:00	Registration & Breakfast
9:00	"Welcome and Introduction"	Bo Cheng, VP Sales AP, GLOBALFOUNDRIES
9:05	"Welcome to the New GLOBALFOUNDRIES"	Jim Kupec, SVP WWSM, GLOBALFOUNDRIES
9:20	"GLOBALFOUNDRIES: The Past, Present and Future"	Doug Grose, CEO, GLOBALFOUNDRIES
9:35	"Global Capacity & Automated Precision Manufacturing: New Sources of Customer Value"	Raj Kumar, SVP, 200mm BU and GM GLOBALFOUNDRIES Singapore, GLOBALFOUNDRIES
10:05	"28 and Beyond: Raising the Bar for Foundry"	Nick Kepler, VP Technology & Integration Engineering, GLOBALFOUNDRIES
10:50	Morning Break - GLOBALSOLUTIONS Exhibits
11:15	"28nm and below: New Frontiers and Innovations in Design for Manufacturing"	Colin Hui, Deputy Director DFM Design Flow, GLOBALFOUNDRIES
11:45	IP/EDA Executive Forum	Invited VIP from Synopsys, Cadence, Mentor and ARM
12:35	Lunch Reception
Technology Session
13:35	"65nm and 40nm Platforms" Questions and Answers	Muljadi Tantra, Senior Director Product Marketing, GLOBALFOUNDRIES
14:00	"Process Design Kits & Design Flows" Questions and Answers	Andy Brotman, VP Design Infrastructure, GLOBALFOUNDRIES
14:25	"Advanced RFCMOS Solution" Questions and Answers	Johnny Chew, Member of Technical Staff, Technology Development, GLOBALFOUNDRIES
14:50	Afternoon Break - GLOBALSOLUTIONS Exhibits
15:15	"BCDlite Platforms for Power Management and Analog Applications" Questions and Answers	P.R. Verma, Director, 200mm BU-TD, GLOBALFOUNDRIES
15:40	"Embedded NVM" Questions and Answers	Sanford Chu, VP Technology Development, GLOBALFOUNDRIES
16:05	"Assembly Solutions" Questions and Answers	Paul Besser, Fellow, Packaging Engineering, GLOBALFOUNDRIES?
16:30	Reception/Sponsored Lucky Draw
16:55	注冊(cè)參會(huì)